Nonvolatile memory devices and methods forming the same

ABSTRACT

Provided are nonvolatile memory devices and methods of forming the same. The nonvolatile memory device includes a plurality of word lines, a ground select line, string select line, and a dummy word line. Each of distances between the dummy word line and the ground select line and between the dummy word line and the word line is greater than a distance between a pair of the word lines adjacent to each other.

CROSS-REFERENCE TO RELATED APPLICATIONS

This patent application is a divisional application of U.S. patentapplication Ser. No. 14/135,049, filed on Dec. 19, 2013, which is adivisional application of U.S. patent application Ser. No. 13/243,968filed on Sep. 23, 2011, which claims priority under 35 U.S.C. §119 toKorean Patent Application No. 10-2010-0096991, filed on Oct. 5, 2010,the disclosures of which are incorporated by reference herein in theirentireties.

BACKGROUND

The embodiments of the present inventive concept relate to semiconductordevices and methods of forming the semiconductor devices and, moreparticularly, to nonvolatile memory devices and methods of forming thenonvolatile memory devices.

Generally, semiconductor memory devices may be categorized into volatilememory devices which lose data upon power-off and nonvolatile memorydevices which retain data when power is last. Flash memory devices areincluded in the nonvolatile memory devices. The flash memory devices arehighly integrated devices which include erasable programmable read onlymemories (EPROMs) and electrically erasable programmable read onlymemories (EEPROMs). The flash memory devices may be classified into aNOR type and a NAND type. The NAND type flash memory devices are formedin strings and have higher density integration as compared to NOR typeflash memory devices.

SUMMARY

Embodiments of the inventive concept may provide nonvolatile memorydevice with improved operation characteristics and methods of formingthe same.

According to an embodiment, a nonvolatile memory device may include aplurality of word lines on a semiconductor substrate, a ground selectline at a side of the word lines, a string select line at another sideof the word lines, a first dummy word line between the ground selectline and a first word line, wherein the first word line is nearest tothe ground select line among the word lines, and a second dummy wordline between the string select line and a second word line, wherein thesecond word line is nearest to the string select line among the wordlines. Each of a first distance between the ground select line and thefirst dummy word line and a second distance between the first dummy wordline and the first word line may be greater than a third distancebetween a pair of the word lines adjacent to each other.

According to an embodiment, each of a distance between the string selectline and the second dummy word line and a distance between the seconddummy word line and the second word line may be greater than the thirddistance.

According to an embodiment, a channel region of the ground select lineand a channel region of the first dummy word line may have the sameconductivity type as a conductivity type of the semiconductor substratebetween the ground select line and the first dummy word line.

According to an embodiment, a source/drain region may be induced in thesemiconductor substrate between the channel regions of the ground selectline and the first dummy word line by a fringe field.

According to an embodiment, a channel region of the string select lineand a channel region of the second dummy word line may have the sameconductivity type as a conductivity type of the semiconductor substratebetween the string select line and the second dummy word line.

According to an embodiment, channel regions of the word lines may havethe same conductivity type as a conductivity type of the semiconductorsubstrate between the channel regions of the word lines.

According to an embodiment, a nonvolatile memory device may include gatepatterns and insulating patterns alternately and repeatedly stacked on asemiconductor substrate, semiconductor patterns penetrating the gatepatterns and the insulating patterns, and upwardly extending from thesemiconductor substrate, and a data storage layer disposed between thesemiconductor patterns and the gate patterns. The gate patterns mayinclude a plurality of word lines, a ground select line under the wordlines, a string select line on the word lines, a first dummy word linebetween the ground select line and a first word line, wherein the firstword line is nearest to the ground select line among the word lines, anda second dummy word line between the string select line and a secondword line, wherein the second word line is nearest to the string selectline among the word lines. Each of a first distance between the groundselect line and the first dummy word line and a second distance betweenthe first dummy word line and the first word line may be greater than athird distance between a pair of the word lines adjacent to each other.

According to an embodiment, a thickness of each of insulating patternsbetween the ground select line and the first dummy word line and betweenthe first dummy word line and the first word line may be greater than athickness of each of insulating patterns between the word lines.

According to an embodiment, each of a distance between the string selectline and the second dummy word line and a distance between the seconddummy word line and the second word line may be greater than the thirddistance.

According to an embodiment, a thickness of each of insulating patternsbetween the string select line and the second dummy word line andbetween the second dummy word line and the second word line may begreater than a thickness of each of the insulating patterns between theword lines.

According to an embodiment, the data storage layer may include a chargetrapping layer having charge trap sites.

According to an embodiment, the data storage layer may extend onto topsurfaces and bottom surfaces of the gate patterns.

According to an embodiment, a method of forming a nonvolatile memorydevice may include alternately and repeatedly forming gate patterns andinsulating patterns on a semiconductor substrate, forming semiconductorpatterns which penetrate the gate patterns and the insulating patternsand upwardly extend from the semiconductor substrate, and forming a datastorage layer between the semiconductor patterns and the gate patterns.The gate patterns may include a plurality of word lines, a ground selectline under the word lines, a string select line on the word lines, afirst dummy word line between the ground select line and a first wordline, wherein the first word line is nearest to the ground select lineamong the word lines, and a second dummy word line between the stringselect line and a second word line, wherein the second word line isnearest to the string select line among the word lines. Each of a firstdistance between the ground select line and the first dummy word lineand a second distance between the first dummy word line and the firstword line may be greater than a third distance between a pair of theword lines adjacent to each other.

According to an embodiment, each of a distance between the string selectline and the second dummy word line and a distance between the seconddummy word line and the second word line may be greater than the thirddistance.

According to an embodiment, forming the gate patterns and the insulatingpatterns may include alternately and repeatedly forming first insulatinglayers and second insulating layers on the semiconductor substrate.

According to an embodiment, the first, second and third distances may beproportional to thicknesses of the first insulating layers.

According to an embodiment, forming the gate patterns and the insulatingpatterns may further include forming a separation region penetrating thefirst insulating layers and the second insulating layers, andselectively removing the second insulating layers exposed by theseparation region and forming undercut regions exposing, thesemiconductor patterns between the first insulating layers.

According to an embodiment, the undercut regions may be filled with thegate patterns.

According to an embodiment, forming the gate patterns and the insulatingpatterns may include alternately and repeatedly forming insulatinglayers and conductive layers on the semiconductor substrate.

According, to an embodiment, the first, second and third distances maybe determined by thicknesses of the insulating layers.

According to an embodiment, a memory device comprises a ground selectline, a first dummy word line, a second dummy word line, a plurality ofword lines including first and second word lines respectively adjacentto the first and second dummy word lines, and a string select line,wherein the lines are arranged in an order of the ground select line,the first dummy word line, the first word line, the second word line,the second dummy word line, and the string select line and wherein adistance between the ground select line and the first dummy word line orbetween the string select line and the second dummy word line and adistance between the first dummy word line and the first word line orbetween the second dummy word line and the second word line are greaterthan a third distance between a pair of the word lines adjacent to eachother.

BRIEF DESCRIPTION OF THE DRAWINGS

The embodiments of the inventive concept will become more apparent inview of the attached drawings and accompanying detailed description.

FIG. 1 is a circuit diagram to describe program disturbance of a twodimensional nonvolatile memory device;

FIG. 2 is a circuit diagram to describe program disturbance of a threedimensional memory device;

FIG. 3 is a cross sectional view illustrating a nonvolatile memorydevice according to an embodiment of the inventive concept;

FIG. 4 is a graph illustrating program characteristics of a nonvolatilememory device according to an embodiment of the inventive concept;

FIG. 5 is a perspective view illustrating a nonvolatile memory deviceaccording to an embodiment of the inventive concept;

FIG. 6 is a perspective view illustrating a nonvolatile memory deviceaccording to an embodiment of the inventive concept;

FIGS. 7A to 7J are perspective views illustrating a method of forming anonvolatile memory device according to an embodiment of the inventiveconcept;

FIGS. 8A to 8J are perspective views illustrating a method of forming anonvolatile memory device according to an embodiment of the inventiveconcept;

FIGS. 9A to 9G are perspective views illustrating a method of forming anonvolatile memory device according to an embodiment of the inventiveconcept;

FIGS. 10A to 10G are perspective views illustrating a method of forminga nonvolatile memory device according to an embodiment of the inventiveconcept;

FIG. 11 is a schematic block diagram illustrating an example of memorysystems including nonvolatile memory devices according to an embodimentof the inventive concept;

FIG. 12 is a schematic block diagram illustrating an example of memorycards including nonvolatile memory devices according to an embodiment ofthe inventive concept; and

FIG. 13 is a schematic block diagram illustrating an example ofinformation processing systems including nonvolatile memory devicesaccording to an embodiment of the inventive concept.

DETAILED DESCRIPTION OF THE EMBODIMENTS

The embodiments of the inventive concept will now be described morefully hereinafter with reference to the accompanying drawings, in which.It will be understood that when an element is referred to as being“connected” or “coupled” to another element, it may be directlyconnected or coupled to the other element or intervening elements may bepresent.

It will be understood that when an element such as a layer, region orsubstrate is referred to as being “on” another element, it can bedirectly on the other element or intervening elements may be present.

FIG. 1 is a circuit diagram to describe program disturbance of a twodimensional nonvolatile memory device.

Referring to FIG. 1, a cell array of a NAND type flash memory device mayinclude a string select line SSL and a ground select line GSL. Wordlines WL₀ to WL_(n-1) may be arranged between the string select line SSLand the ground select line GSL. Each of the string select line SSL, theground select line GSL, and the word lines WL₀ to WL_(n-1) may include adata storage layer and a control gate. Program voltage conditions of amemory cell MC_(1i) selected in the NAND type flash memory device areillustrated in FIG. 1. A ground voltage GND may be applied to a selectedbit line BL_(i), a power voltage Vcc may be applied to a non-selectedbit line BL_(i+1), and the power voltage Vcc may be applied to thestring select line SSL. The ground voltage GND may be applied to theground select line GSL, and the ground voltage GND may be applied to acommon source line CSL. A program voltage Vpgm may be applied to aselected word line WL₀, and a pass voltage Vpass may be applied tonon-selected word lines WL₁ to WL_(n-1). The ground voltage may beapplied to a substrate.

A memory cell Mc_(1i+1) connected to the selected word line WL₀ and thenon-selected hit line BL_(i+1) is prevented from being programmed. Thus,a channel voltage of the memory cell Mc1 _(i+1) connected to theselected word line WL₀ and the non-selected bit line BL_(i+1) may beboosted to a high level.

Due to a potential difference between a channel region of the groundselect line GSL and the channel region boosted to the high level, astrong electric field may be generated in a source/drain region betweenthe ground select line GSL and the word line WL₀ adjacent to the groundselect line GSL. Thus, electron-hole pairs may be generated. Holes ofthe electron-hole pairs may be moved toward the substrate by a substratebias, and electrons may become hot electrons by a laterally strongelectric field generated from a channel voltage of the ground selectline GSL and a channel voltage of the selected word line WL₀. The hotelectrons may be scattered at the selected word line WL₀ and injectedinto the data storage layer. This phenomenon may occur between thestring select line SSL and the word line WL_(n-1) adjacent to the stringselect line SSL. Thus, a program disturbance phenomenon may occur. Theprogram disturbance phenomenon means that a program-inhibited cell isprogrammed.

FIG. 2 is a circuit diagram to describe program disturbance of a threedimensional memory device.

Referring to FIG. 2, a three dimensional device may include a commonsource line CSL, a plurality of bit lines BL0, BL1, BL2, and BL3, and aplurality of cell strings CSTR disposed between the common source lineCSL and the bit lines BL0 to BL3.

The common source line CSL may be a conductive layer disposed on asemiconductor substrate or an impurity region formed in thesemiconductor substrate. The bit lines BL0 to BL3 may be conductivepatterns (e.g. metal lines) which are spaced apart from thesemiconductor substrate over a top surface of the semiconductorsubstrate. The bit lines BL0 to BL3 may be two dimensionally arranged,and a plurality of cell strings CSTR may be connected to each of the bitlines BL0 to BL3 in parallel. Thus, the cell strings CSTR may be twodimensionally arranged on the common source line CSL or thesemiconductor substrate.

Each of the cell strings CSTR may include, a ground select transistorGST connected to the common source line CSL, a string select transistorSST connected to each of the bit lines BL0 to BL3, and a plurality ofmemory cell transistors MCT disposed between the ground and stringselect transistors GST and SST. The ground select transistor GST, thememory cell transistors MCT, and the string select transistor SST may beconnected to each other in series. A ground select line GSL, a pluralityof word lines WL0 to WL3, and a plurality of string select lines SSL,which are disposed between the common source line CSL and the bit linesBL0 to BL3, may be used as gate electrodes of the ground selecttransistors GST, the memory cell transistors MCT, and the string selecttransistors SST, respectively.

The ground select transistors GST may be disposed at substantially thesame distance from the semiconductor substrate, and gate electrodes ofthe ground select transistors GST may be jointly connected to the groundselect line GSL to be in an equipotential state. The ground select lineGSL may be a conductive pattern having a plate shape or a comb shapewhich is disposed between the common source line CSL and, the memorycell transistor MCT adjacent to the common source line CSL. Similarly,gate electrodes of a plurality of the memory cell transistors MCT whichare disposed at substantially the same distance from the common sourceline CSL may also be jointly connected to one of the word lines WL0 toWL3 to be in an equipotential state. Each of the word lines WL0 to WL3may be a conductive pattern having a plate shape or a comb shapeparallel to a top surface of the substrate. Since one cell string CSTRmay consist of a plurality of the memory cell transistors MCT which aredisposed at different distances from the common source line CSL,multi-layered word lines WL0 to WL3 may be disposed between the commonsource line CSL and the bit lines BL0 to BL3.

Each of the cell strings CSTR may include a semiconductor pillar whichvertically extends from the common source line CSL and is connected to acorresponding bit line of the bit lines BL0 to BL3. The semiconductorpillars may be formed to penetrate the ground select line GSL and theword lines WL0 to WL3. Each of the semiconductor pillars may include abody portion and an impurity region formed at one end or both ends ofthe body portions. For example, a drain region may be formed at a topend of the semiconductor pillar.

A data storage layer may be disposed between the word lines WL0 to WL3and the semiconductor pillar. According to an embodiment, the datastorage layer may be a charge storage layer. For example, the datastorage layer may include one of a trap insulating layer, a floatinggate electrode, or an insulating layer including conductive nano dots.

A dielectric layer used as a gate insulating layer of the ground selecttransistor GST or the string select transistor SST may be disposedbetween the ground select line GSL and the semiconductor pillar, orbetween the string select line SSL and the semiconductor pillar. Thegate insulating layer of at least one of the ground and string selecttransistors GST and SST may be formed of the same material as the datastorage layer of the memory cell transistor MCT or may include a gateinsulating layer (e.g. a silicon oxide layer) for a general MOS fieldeffect transistor (MOSFET).

The ground and string select transistors GST and SST and the memory celltransistors MCT may be MOS field effect transistors using thesemiconductor pillar as channel regions. According to an embodiment, thesemiconductor pillar may form MOS capacitors with the ground select lineGSL, the word lines WL0 to WL3, and the string select, lines SSL.According to an embodiment, the ground select transistor GST, the memorycell transistors MCT, and the string select transistors SST may shareinversion layers formed by fringe fields of the ground select line GSL,word lines WL0 to WL3, and string select line SSL and are thuselectrically connected to each other.

The program disturbance phenomenon may be caused at the threedimensional device illustrated in FIG. 2 under the same voltageconditions as described with reference to FIG. 1 by the same principleas described with reference to FIG. 1. For example, a non-selectedmemory cell MC2 may be programmed under program voltage conditions for aselected memory cell MC1.

FIG. 3 is a cross sectional view illustrating a nonvolatile memorydevice according to an embodiment of the inventive concept. FIG. 4 is agraph illustrating program characteristics of a nonvolatile memorydevice according to an embodiment of the inventive concept.

Referring to FIG. 3, a plurality of word lines WL0 to WLn-1 are providedon a semiconductor substrate 10. The semiconductor substrate 10 mayinclude impurities of a first conductivity type (e.g. P-type). Each ofthe word lines WL0 to WLn-1 may include a tunnel insulating layer 20 onthe semiconductor 10, a charge trapping layer 30 on the tunnelinsulating layer 20, a blocking insulating layer 40 on the chargetrapping layer 30, a control gate 50 on the blocking insulating layer40, and a hard mask 60 on the control gate 50.

A ground select line GSL may be provided at one side of the word linesWL0 to WLn-1. A string select line SSL may be provided at another sideof the word lines WL0 to WLn-1. A first dummy word line DWL1 may bedisposed between the ground select line GSL, and the word line WL0 whichis a word line nearest to the ground select line GSL among the wordlines WL0 to WLn-1. A second dummy word line DWL2 may be disposedbetween the string select line SSL and the word line WLn-1 which is aword line nearest to the string select line SSL among the word lines WL0to WLn-1. The first and second dummy word lines DWL1 and DWL2 candecrease a horizontal electric field to reduce the program disturbancephenomenon.

Each of a first distance L1 between the ground select line GSL and thefirst dummy word line DWL1 or between the string select line SSL and thesecond dummy word line DWL2 and a second distance L2 between the firstdummy word line DWL1 and the word line WL0 or between the second dummyword line DWL2 and the word line WLn-1 is greater than a third distanceL3 between a pair of the word lines adjacent to each other among theword lines WL0 to WLn-1.

The first distance L1 may be equal to or greater than the seconddistance L2. According to an embodiment, the first distance L1 may beless than the second distance L2. Channel regions of the ground selectline GSL and the first dummy word line DWL1 may have the sameconductivity type as the semiconductor substrate 10 between the groundselect line GSL and the first dummy word line DWL1. For example, asource/drain region having a conductivity type opposite to aconductivity type of the semiconductor substrate 10 may not be formedbetween the ground select line GSL and the first dummy word line DWL1.According to an embodiment of the inventive concept, a source/drain maybe induced at the semiconductor substrate 10 between the ground selectline GSL and the first dummy word line DWL1 by a fringe field.

Channel regions of the string select line SSL and the second dummy wordline DWL2 may have the same conductivity type as the semiconductorsubstrate 10 between the string select line SSL and the second word lineDWL2. Channel regions of the word lines WL0 to WLn-1 may have the sameconductivity type as the semiconductor substrate it) between the channelregions of the word lines WL0 to WLn-1. As a consequence, the string ofthe nonvolatile memory device according to an embodiment of theinventive concept may induce a source/drain region using the fringefield.

Referring to FIG. 4, a horizontal axis shows voltages, and a verticalaxis shows electric field values in a program operation. A referencemark E1 shows an electric field applied to the word line when hotelectrons are generated.

Generally, if the first distance L1 extends and the second distance L2is equal to the third distance L3, a maximum electric field valuebetween the ground select line GSL and the first dummy word line DWL1may be reduced. However, when the source/drain region between the groundselect line GSL and the first dummy word line DWL1 is generated by thefringe field, a cell current may be abnormally reduced. If a voltage ofthe first dummy word line DWL1 is reduced during the program operation,a maximum electric field between the ground select line GSL and thefirst dummy word line DWL1 may be reduced, but a maximum electric fieldbetween the first dummy word line DWL1 and the word line WL0 may beincreased to generate hot electrons.

FIG. 4 will be described by comparing an embodiment of the inventiveconcept with the above case that the second distance L2 is equal to thethird distance L3 and the first distance L1 is greater than each of thesecond and third distances L2 and L3.

Each of the first and second distances L1 and L2 greater than the thirddistance L3 means that the maximum electric field GTD between the groundselect line GSL and the first dummy word line DWL1 increases and themaximum electric field DTW between the first dummy word line DWL1 andthe word hue WL0 decreases.

According to the embodiment described in connection with FIG. 3, when avoltage of the first dummy word line DWL1 is controlled, a programdisturbance may be minimized or prevented, and weakening of the fringefield may be minimized.

FIG. 5 is a perspective view illustrating a nonvolatile memory deviceaccording to an embodiment of the inventive concept. The principlepreventing the program disturbance, which has been described withreference to FIGS. 3 and 4, can apply to the nonvolatile memory deviceillustrated in FIG. 5.

Referring to FIG. 5, gate patterns GSL, DWL1, WL0˜WLn-1, DWL2, and SSLand insulating patterns 112 may be alternately and repeatedly stacked ona semiconductor substrate 100. A buffer insulating layer 105 may bedisposed between a lowermost gate pattern GSL among the gate patternsand the semiconductor substrate 100. The buffer insulating layer 105 mayinclude a silicon oxide layer. The gate patterns GSL, DWL1, WL0˜WLn-1,DWL2, and SSL may include poly silicon having conductivity and/or ametal. The insulating patterns 112 may include a silicon oxide layer.

Semiconductor patterns 170 may upwardly extend from the semiconductorsubstrate 100 to penetrate the gate patterns GSL, DWL1, WL0˜WLn-1, DWL2,and SSL and the insulating patterns 112. The semiconductor patterns 170may include silicon. A data storage layer 140 may be disposed betweenthe semiconductor patterns 170 and the gate patterns GSL, DWL1,WL0˜WLn-1, DWL2, and SSL. The data storage layer 140 may further bedisposed on a top surface and a lower surface of each of the gatepatterns GSL, DWL1, WL0˜WLn-1, DWL2, and SSL. The data storage layer 140may include a tunnel insulating layer 142, a charge trapping layer 144,and a blocking insulating layer 146. The charge trapping layer 144 mayhave charge trap sites. A filling layer 160 may be disposed in a throughregion at each of the semiconductor patterns 170.

A separation insulating layer 172 may be disposed between semiconductorpatterns 170. The separation insulating layer 172 may separate the gatepatterns GSL, DWL1, WL0˜WLn-1, DWL2, and SSL from neighboring gatepatterns. A common source region 102 may be disposed in thesemiconductor substrate 100 under the separation insulating layer 172.An upper interlayer insulating layer 180 may be disposed on thesemiconductor patterns 170 and the gate patterns GSL, DWL1, WL0˜WLn-1,DWL2, and SSL. Contact plugs 185 may be disposed in the upper interlayerinsulating layer 180 to be electrically connected to the semiconductorpatterns 170, respectively. Bit lines 190 may cross the gate patternsGSL, DWL1, WL0˜WLn-1, DWL2, and SSL and may be electrically connected tothe contact plugs 185.

The gate patterns GSL, DWL1, WL0˜WLn-1, DWL2, and SSL may include aplurality of word lines WL0 to WLn-1, a ground select line GSL under theword lines WL0 to WLn-1, a string select line SSL on the word lines WL0to WLn-1, a first dummy word line DWL1 between the ground select lineGSL and the word line WL0 which is a word line nearest to the groundselect line GSL among the word lines WL0 to WLn-1, and a second dummyword line DWL2 between the string select line SSL and the word lineWLn-1 which is a word line nearest to the string select line SSL amongthe word lines WL0 to WLn-1. Each of the first distance L1 between theground select line GSL and the first dummy word line DWL1 or between thestring select line SSL and the second dummy word line DWL2 and thesecond distance L2 between the first dummy word line DWL1 and the wordline WL0 or between the second dummy word line DWL2 and the word lineWLn-1 is greater than a third distance L3 between a pair of the wordlines adjacent to each other among the word lines WL0 to WLn-1.

A thickness of each of the insulating patterns 112 between the groundselect line GSL and the first dummy word line DWL1 and between the firstdummy word line DWL1 and the word line WL0 may be greater than athickness of each of the insulating patterns 112 between the word linesWL0 to WLn-1. A thickness of each of the insulating patterns 112 betweenthe string select line SSL and the second dummy word line DWL2 andbetween the second dummy word line DWL2 and the word line WLn-1 may begreater than the thickness of each of the insulating patterns 112between the word lines WL0 to WLn-1. The first distance L1 may be equalto or greater than the second distance L2. According to an embodiment,the first distance L1 may be less than the second distance L2. The gatepatterns GSL, DWL1, WL0˜WLn-1, DWL2, and SSL may be close to each otherto induce source/drain regions in the semiconductor patterns 170 by thefringe field. Accordingly, the program disturbance of the threedimensional nonvolatile memory device can be reduced and a cell currentof the three dimensional nonvolatile memory device may be secured.

FIG. 6 is a perspective view illustrating a nonvolatile memory deviceaccording to an embodiment of the inventive concept. The principlepreventing the program disturbance, which is described with reference toFIGS. 3 and 4, can apply to the nonvolatile memory device illustrated inFIG. 6.

Referring to FIG. 6, gate patterns GSL, DWL1, WL0˜WLn-1, DWL2, and SSLand insulating patterns 312 may be alternately and repeatedly stacked ona semiconductor substrate 300. A buffer insulating layer 305 may bedisposed between a lowermost gate pattern GSL among the gate patternsGSL, DWL1, WL0˜WLn-1, DWL2, and SSL and the semiconductor substrate 300.Semiconductor patterns 370 may upwardly extend from the semiconductorsubstrate 300 to penetrate the gate patterns GSL, DWL1, WL0˜WLn-1, DWL2,and SSL and the insulating patterns 312. A data storage layer 340 may bedisposed between the semiconductor patterns 370 and the gate patternsGSL, DWL1, DWL2, and SSL. The data storage layer 340 may extend along asidewall of the semiconductor pattern 370. The data storage layer 340may include a tunnel insulating layer 342, a charge trapping layer 344,and a blocking insulating layer 346. A filling layer 360 may be disposedin a through region at each of the semiconductor patterns 370.

A common source region 302 may be provided at an upper portion of thesemiconductor substrate 300. An upper interlayer insulating layer 380may be disposed on the semiconductor patterns 370 and the gate patternsGSL, DWL1, WL0˜WLn-1, DWL2, and SSL. Contact plugs 385 may be disposedin the upper interlayer insulating layer 380 to be electricallyconnected to the semiconductor patterns 370, respectively. Bit lines 390may cross the gate patterns GSL, DWL1, WL0˜WLn-1, DWL2, and SSL and maybe electrically connected to the contact plugs 385.

The gate patterns GSL, DWL1, WL0˜WLn-1, DWL2, and SSL may include aplurality of word lines WL0 to WLn-1 to a ground select line GSL underthe word lines WL0 to WLn-1, a string select line SSL on the word linesWL0 to WLn-1, a first dummy word line DWL1 between the ground selectline and the word line WL0 which is a word line nearest to the groundselect line GSL among, the word lines WL0 to WLn-1, and a second dummyword line DWL2 between the string select line SSL and the word lineWLn-1 which is a word line nearest to the string select line SSL amongthe word lines WL0 to WLn-1. Each of the first distance L1 between theground select line GSL and the first dummy word line DWL1 or between thestring select line SSL and the second dummy word line DWL2 and thesecond distance L2 between the first, dummy word line DWL1 and the wordline WL0 or between the second dummy word line DWL2 and the word lineWLn-1 is greater than the third distance L3 between a pair of the wordlines adjacent to each other among the word lines WL0 to WLn-1.

A thickness of each of the insulating patterns 312 between the groundselect line GSL and the first dummy word line DWL1 and between the firstdummy word line DWL1 and the word line WL0 may be greater than athickness of each of the insulating patterns 312 between the word linesWL0 to WLn-1. A thickness of each of the insulating patterns 312 betweenthe string select line SSL and the second dummy word line DWL2 andbetween the second dummy word line DWL2 and the word line WLn-1 may begreater than the thickness of each of the insulating patterns 312between the word lines WL0 to WLn-1. The first distance L1 may be equalto or greater than the second distance L2. According to an embodiment,the first distance L1 may be less than the second distance L2. The gatepatterns GSL, DWL1, WL0˜WLn-1, DWL2, and SSL may be close to each otherto induce source/drain regions in the semiconductor patterns 370 by thefringe field.

FIGS. 7A to 7J are perspective views illustrating a method of forming anonvolatile memory device according to an embodiment of the inventiveconcept.

Referring to FIG. 7A, a thin layer structure 115 including a pluralityof thin layers may be formed on the semiconductor substrate 100. Thethin layer structure 115 may include first insulating layers 110 andsecond insulating layers 120 which are alternately and repeatedlystacked. For example, the thin layer structure 115 may include aplurality of the first insulating layers 110 sequentially stacked and aplurality of second insulating layers 120 interposed between the firstinsulating layers 110. The first insulating layers 110 may havethicknesses for satisfying the conditions as described with reference toFIG. 5. The conditions means that each of the first distance L1 betweenthe ground select line GSL and the first dummy word line DWL1 and thesecond distance L2 between the first dummy word line DWL1 and the wordline WL0 is greater than the third distance L3 between a pair of theword lines adjacent to each other, and each of the first distance L1between the string select line SSL and the second dummy word line DWL2and the second distance 12 between the second dummy word line DWL2 andthe word line WLn-1 is greater than the third distance L3 between a pairof the word lines adjacent to each other.

The first insulating layers 110 may have wet etch rates different fromwet etch rates of the second insulating layers 120. For example, thefirst insulating layers 110 may include silicon oxide layers, and thesecond insulating layers 120 may include silicon nitride layers. Abuffer insulating layer 105 may be formed between the thin layerstructure 115 and the semiconductor substrate 100. The buffer insulatinglayer 105 may include a silicon oxide layer.

Referring to FIG. 7B, the thin layer structure 115 may be patterned toform a plurality of through regions 130 exposing a top surface of thesemiconductor substrate 100. Patterning the thin, layer structure 115may include patterning the first insulating layers 110 and the secondinsulating layers 120 to form first insulating patterns 112 and secondinsulating patterns 122. In more detail, a mask pattern (not shown)defining top viewed locations of the through regions 130 may be formedon the thin layer structure 115, and then the thin layer structure 115may be anisotropically etched using the mask pattern as an etch mask thethrough regions 130. The through regions 130 may be formed twodimensionally and regularly. As illustrated in FIG. 7B, the throughregions 130 may be trenches which have rectangular bottom surfacesexposing the top surface of the semiconductor substrate 100.

Referring to FIG. 7C, a semiconductor layer 150 may be formed to coverthe through regions 130. The semiconductor layer 150 may be formed todefine a gap region 135 in each of the through regions 130. Thesemiconductor layer 150 may be formed by a chemical vapor deposition(CVD) method.

Referring to FIG. 7D, a filling layer 160 may be formed in the throughregion 130. The filling layer 160 may be formed to fill the gap region135. An insulating layer filling the gap region 135 may be formed andthen a planarization process may be performed on the insulating layer toform the filling layer 160. Alternatively, the semiconductor layer 150may be formed to fill the through region 130 and the filling layer 160may not be formed.

The semiconductor layer 150 may be patterned to form semiconductorpatterns 170 upwardly extending from the semiconductor substrate 100 inthe through regions 130. The semiconductor patterns 170 may extend tocross sidewalk of the first and second insulating patterns 112 and 122.The formation process of the semiconductor patterns 170 may includeforming separation regions dividing the semiconductor layer 150 into thesemiconductor patterns 170. The separation region may be filled with agapfill insulating layer 174. The gapfill insulating layer 174 mayinclude a silicon oxide layer.

Referring to FIG. 7E, a first separation region 162 may be formed todivide the first and second patterns 112 and 122 between the throughregions 130 illustrated in FIG. 7C. The first separation region 162 mayexpose the semiconductor substrate 100. The first separation region 162may be formed by an anisotropic etching process. The first separation,region 162 may be disposed between the filling layers 160 respectivelydisposed in the through regions.

Referring to FIG. 7F, the second insulating patterns 122 exposed by thefirst separation region 162 may be removed to form undercut regions 164.Since the second insulating patterns 122 are removed, the semiconductorpatterns 170 between the first insulating patterns 112 may be exposed.The second insulating patterns 122 may be removed by a wet etchingprocess. The second insulating patterns 122 may have an etch selectivitywith respect to the first insulating patterns 112.

Referring to FIG. 7G, a data storage layer 140 may be formed to coverthe exposed first insulating patterns 122 and semiconductor patterns170. The data storage layer 140 may include a charge trapping layer 144having charge trap sites. In more detail, the data storage layer 140 mayinclude a tunnel insulating layer 142 contacting the semiconductorpatterns 170, the charge trapping layer 144 on the tunnel insulatinglayer 142, and a blocking insulating layer 146 on the charge trappinglayer 144. The charge trapping layer 144 may include a silicon nitridelayer, the tunnel insulating layer 142 may include a silicon oxide layeror a multi-layer having the silicon oxide layer, and the blockinginsulating layer 146 may include a high-k dielectric layer (e.g. analuminum oxide layer or a hafnium layer). The data storage layer 140having three thin layers is illustrated in FIG. 7G. However, theembodiments of the inventive concept are not limited thereto. Accordingto an embodiment, the data storage layer 140 may include thin layersmore than three thin layers under data storing conditions.

Referring to FIG. 7H, gate patterns 165 may be respectively formed inthe undercut regions 164 between the first insulating patterns 112. Thegate patterns 165 may be formed of poly silicon and/or metal. The gatepatterns 165 may have line shapes extending in one direction. Theformation process of the gate patterns 165 may include forming a gateconductive layer between the first insulating patterns 112 on which thedata storage layer 140 is formed and patterning the gate conductivelayer to form a second separation region 163 dividing the gateconductive layer. The second separation region 163 may be formed at thesame location as a location of the first separation region 162 and mayexpose sidewalls of the first insulating patterns 112.

Referring to FIG. 7I, a common source region 102 may be formed in thesemiconductor substrate 100 exposed by the second separation region 163.The common source region 102 may be formed by an ion implantationprocess. A separation insulating, layer 172 filling the secondseparation region 163 may be formed. The separation insulating layer 172may include a silicon oxide layer. An insulating layer filling thesecond separation region 163 may be formed and then a planarizationprocess may be performed on the insulating layer to form the separationinsulating layer 172.

Referring to FIG. 7J, an upper interlayer insulating layer 180 may beformed on the semiconductor patterns 170 and the gate patterns. Contactplugs 185 may be formed in the upper interlayer insulating layer 180 tobe electrically connected to the semiconductor patterns 170,respectively. Bit lines 190 may be formed to be electrically connectedto the contact plugs 185. The bit line 190 may extend in a directioncrossing a direction in which the gate pattern extends.

The gate patterns may include a plurality of word lines WL0 to WLn-1, aground select line GSL under the word lines WL0 to WLn-1, a stringselect line SSL on the word lines WL0 to WLn-1, a first dummy word lineDWL1 between the ground select line GSL and the word line WL0 which is aword line nearest to the ground select line GSL among the word fines WL0to WLn-1, and a second du my word line DWL2 between the string selectline SSL and the word line WLn-1 which is a word line nearest to thestring select line SSL among the word lines WL0 to WLn-1. Each of thefirst distance L1 between the ground select line GSL and the first dummyword line DWL1 or between the string select line SSL and the seconddummy word line DWL2 and the second distance L2 between the first dummyword line DWL1 and the word line WL0 or between the second dummy wordline DWL2 and the word line WLn-1 is greater than a third distance L3between a pair of the word lines adjacent to each other among the wordlines WL0 to WLn-1.

The first distance L1, the second distance L2, and the third distance L3may be proportional to thicknesses of the insulating patterns 112. Athickness of each of the insulating patterns 112 between the groundselect line GSL and the first dummy word line DWL1 and between the firstdummy word line DWL1 and the word line WL0 may be greater than athickness of each of the insulating patterns 112 between the word linesWL0 to WLn-1. A thickness of each of the insulating patterns 112 betweenthe string select line SSL and the second dummy word line DWL2 andbetween the second dummy word line DWL2 and the word line WLn-1 may begreater than a thickness of each of the insulating patterns 112 betweenthe word lines WL0 to WLn-1. The first distance L1 may be equal to orgreater than the second distance L2. Alternatively, the first distanceL1 may be less than the second distance L2. The gate patterns GSL, DWL1,WL0˜WLn-1, DWL2, and SSL may be disposed to be adjacent to each other,so that source/drain regions may be induced in the semiconductorpatterns 170 by the fringe field. As a consequence, the programdisturbance of the three dimensional nonvolatile memory device can bereduced and a cell current of the three dimensional nonvolatile memorydevice may be secured.

FIGS. 8A to 8J are perspective views illustrating a method of forming anonvolatile memory device according to an embodiment of the inventiveconcept.

Referring to FIG. 8A, a thin layer structure 215 including a pluralityof thin layers may be formed on a semiconductor substrate 200. The thinlayer structure 215 may include first insulating layers 210 and secondinsulating layers 220 which are alternately and repeatedly stacked. Forexample, the thin layer structure 215 may include a plurality of thefirst insulating layers 210 sequentially stacked and a plurality ofsecond insulating layers 220 interposed between the first insulatinglayers 210. The first insulating layers 210 may have thicknesses forsatisfying the conditions as described with reference to FIG. 5. Theconditions means that each of the first distance L1 between the groundselect line GSL and the first dummy word line DWL1 and the seconddistance L2 between the first dummy word line DWL1 and the word line WL0is greater than the third distance L3 between a pair of the word linesadjacent to each other.

The first insulating layers 210 may have wet etch rates different fromwet etch rates of the second insulating layers 220. For example, thefirst insulating layers 210 may include silicon oxide layers, and thesecond insulating layers 220 may include silicon nitride layers. Abuffer insulating layer 205 may be formed between the thin layerstructure 215 and the semiconductor substrate 200. The buffer insulatinglayer 205 may include a silicon oxide layer.

Referring to FIG. 8B, the thin layer structure 215 may be patterned toform a plurality of through regions 230 exposing a top surface of thesemiconductor substrate 200. Patterning the thin layer structure 215 mayinclude patterning the first insulating layers 210 and the secondinsulating layers 220 to form first insulating patterns 212 and secondinsulating patterns 222. In more detail, a mask pattern (not shown)defining top viewed locations of the through regions 230 may be formedon the thin layer structure 215, and then the thin layer structure 215may be anisotropically etched using the mask pattern as an etch mask toform the through regions 230. The through regions 230 may be formed twodimensionally and regularly. Each of the through regions 230 may have ahole-shape which has a circular bottom surface exposing the top surfaceof the semiconductor substrate 200.

Referring to FIG. 8C, a semiconductor layer may be formed to cover thethrough regions 230. The semiconductor layer may be planarized to formsemiconductor pattern 270 in each of the through regions 230. Thesemiconductor pattern 270 may be formed to define a gap region 235 ineach of the through regions 230. The semiconductor layer may be formedby a chemical vapor deposition (CVD) method.

Referring to FIG. 8D, a filling layer 260 may be formed in the throughregion 230. The filling layer 260 may be formed to fill the gap region235. An insulating layer filling the gap region 235 may be formed andthen a planarization process may be performed on the insulating layer toform the filling layer 260. According to an embodiment, before thesemiconductor patterns 270 are formed, the insulating layer filling thegap region 235 may be formed on the semiconductor layer, and then theinsulating layer and the semiconductor layer may be subsequentlyplanarized to form the filling layer 260 and the semiconductor pattern270. Alternatively, the semiconductor layer may be formed to fill thethrough region 230, so that the filling layer 260 may not be formed.

Referring to FIG. 8E, a first separation region 262 may be formed todivide the first and second insulating patterns 212 and 222 between thesemiconductor patterns 270. The first separation region 262 may exposethe semiconductor substrate 200. The first separation region 262 may beformed by an anisotropic etching process. The first separation region262 may extend in one direction. The semiconductor patterns 270, whichare arranged in the one direction to constitute a first column, may bedisposed at one side of the first separation region 262. Thesemiconductor patterns 270, which are arranged in the one direction toconstitute a second column, may be disposed at another side of the firstseparation region 262.

Referring to FIG. 8F, the second insulating patterns 222 exposed by thefirst separation region 262 may be removed to form undercut regions 264.Since the second insulating patterns 222 are removed, the semiconductorpatterns 270 between the first insulating patterns 212 may be exposed.The second insulating patterns 222 may be removed by a wet etchingprocess. The second insulating patterns 222 may have an etch selectivitywith respect to the first insulating patterns 212.

Referring, to FIG. 8G, a data storage layer 240 may be formed to coverthe exposed first insulating patterns 222 and semiconductor patterns270. The data storage layer 240 may include a charge trapping layer 244having charge trap sites. In more detail, the data storage layer 240 mayinclude a tunnel insulating layer 242 contacting the semiconductorpatterns 270, the charge trapping layer 244 on the tunnel insulatinglayer 242, and a blocking insulating layer 246 on the charge trappinglayer 244. The charge trapping layer 244 may include a silicon nitridelayer, the tunnel insulating layer 242 may include a silicon oxide layeror a multi-layer having the silicon oxide layer, and the blockinginsulating layer 246 may include a high-k dielectric layer (e.g. analuminum oxide layer or a hafnium oxide layer). The data storage layer240 having three thin layers is illustrated in FIG. 8G. However, theembodiments of the inventive concept are not limited thereto. Accordingto an embodiment, the data storage layer 240 may include thin layersmore than three thin layers under data storing condition.

Referring to FIG. 8H, gate patterns 265 may be respectively formed inthe undercut regions 264 between the first insulating patterns 212. Thegate patterns 265 may be formed of poly silicon and/or metal. The gatepatterns 265 may have line shapes extending in one direction. Theformation process of the gate patterns 265 may include forming a gateconductive layer between the first insulating patterns 212 on which thedata storage layer 240 is formed and patterning the gate conductivelayer to form a second separation region 263 dividing the gateconductive layer. The second separation region 263 may be formed at thesame location as a location of the first, separation region 262 and mayexpose sidewalls of the first insulating patterns 212. A common sourceregion 202 may be formed in the semiconductor substrate 200 exposed bythe second separation region 263. The common source region 202 may beformed by an ion implantation process.

Referring to FIG. 8I, a separation insulating layer 272 filling thesecond separation region 263 may be formed. The separation insulatinglayer 272 may include a silicon oxide layer. The semiconductor pattern270 and the gate patterns 265 may constitute transistors threedimensionally arranged.

Referring to FIG. 8J, bit lines 290 may be formed to be electricallyconnected to the semiconductor patterns 270. The bit line 290 may extendin a direction crossing a direction in which the grate pattern extends.An upper interlayer insulating layer 280 may be formed on thesemiconductor pattern 270 and the gate patterns. Contact plugs 285 maybe formed in the upper interlayer insulating layer 280. The contact plug285 may electrically connect the hit lines 290 to the semiconductorpatterns 270.

The gate patterns may include a plurality of word lines WL0 to WLn-1, aground select line GSL under the word lines WL0 to WLn-1, a stringselect line SSL on the word lines a first dummy word line DWL1 betweenthe ground select line GSL and the word line WL0 which is a word linenearest to the ground select line GSL among the word lines WL0 to WLn-1,and a second dummy word line DWL2 between the string select line SSL andthe word line WLn-1 which is a word line nearest to the string selectline SSL among the word lines WL0 to WLn-1. Each of the first distanceL1 between the ground select line GSL and the first dummy word line DWL1or between the string select line SSL and the second dummy word lineDWL2 and the second distance L2 between the first dummy word line DWL1and the word line WL0 or between the second dummy word line DWL2 and theword line WLn-1 is greater than a third distance L3 between a pair ofthe word lines adjacent to each other among the word lines WL0 to WLn-1.

FIGS. 9A to 9G are perspective views illustrating a method of forming anonvolatile memory device according to an embodiment of the inventiveconcept. Referring to FIG. 9A, a thin layer structure 315 including aplurality of thin layers may be formed on a semiconductor substrate 300.The semiconductor substrate 300 may be formed of single-crystallinesilicon. Alternatively, the semiconductor substrate 300 may be formed ofa semiconductor material providing other semiconductor characteristicsthan the single-crystalline silicon.

The thin layer structure 315 may include insulating layers 310 andconductive layers 320 which are alternately and repeatedly stacked. Forexample, the thin layer structure 315 may include a plurality of theinsulating layers 310 sequentially stacked and a plurality of theconductive layers 320 interposed between the insulating layers 310.Thicknesses of the insulating layers 310 may determine the first, secondand third distances L1, L2 and L3 described with reference to FIG. 5.For example, the first insulating layers 310 may have thicknesses forsatisfying the conditions that each of the first distance L1 between theground select line GSL and the first dummy word line DWL1 and the seconddistance L2 between the first dummy word line DWL1 and the word line WL0is greater than the third distance L3 between a pair of the word linesadjacent to each other.

For example, each of the insulating layers 310 may include a siliconoxide layer and/or a silicon nitride layer, and each of the conductivelayers 320 may formed of poly-crystalline silicon doped with impuritiesand/or a metallic material. A buffer insulating layer 305 may be formedbetween the semiconductor substrate 300 and the thin layer structure315. The buffer insulating layer 305 may include a silicon oxide layer.

Referring to FIG. 9B, the thin layer structure 315 may be patterned toform a plurality of through regions 330 exposing a top surface of thesemiconductor substrate 300. Patterning the thin layer structure 315 mayinclude patterning the insulating layers 310 and the conductive layers320 to form insulating patterns 312 and gate patterns 322. In moredetail, a mask pattern (not shown) defining top viewed locations of thethrough regions 330 may be formed on the thin layer structure 315, andthen the thin layer structure 315 may be anisotropically etched usingthe mask pattern as an etch mask to form the through regions 330. Thethrough regions 330 may be formed two dimensionally and regularly.

As illustrated in FIG. 9B, each of the through regions 330 may be atrench which has a rectangular bottom surface exposing the semiconductorsubstrate 300. A lowermost gate pattern of the stacked gate patterns 322may be used as a ground select line, and an uppermost gate pattern ofthe stacked gate patterns 322 may be used as a string select line.

Referring to FIG. 9C, a data storage layer 340 may be formed to coverthe inner sidewalk of the through regions 330. The data storage layer340 may include a charge trapping layer 344 having charge trap sites.The data storage layer 340 may further include a blocking insulatinglayer 346 contacting the gate patterns 322 and a tunnel insulating layer342. Charges may tunnel the tunnel insulating layer 342. The chargetrapping layer 344 may include a silicon nitride layer formed betweenthe tunnel insulating layer 342 and the blocking insulating layer 346.The tunnel insulating layer 342 may include a silicon oxide layer. Theblocking insulating layer 346 may include a high-k dielectric layer(e.g. an aluminum oxide layer or a hafnium oxide layer).

However, the data storage layer 310 is not limited to the thin layersdescribed above. According to an embodiment, the data storage layer 340may include a thin layer (e.g. a thin layer for a variable resistancememory) storing data by other operation principles. A preliminary datastorage layer may be conformally formed on the inner sidewalls of thethrough region 330 and the semiconductor substrate 300 under the throughregions 330, and then a portion of the preliminary data storage layercovering the semiconductor substrate 300 may be etched using spacers(not shown) covering the inner sidewalk of the through regions 330 asetch masks to form the data storage layer 340. The spacers may includean insulating layer. The spacers may be removed after the data storagelayer 340 is formed.

Retelling to FIG. 9D, a semiconductor layer 350 may be formed to coverthe through regions 330. The semiconductor layer 350 may be formed todefine a gap region 335 in each of the through regions 330. Thesemiconductor layer 150 may be formed by a chemical vapor deposition(CND) method. The semiconductor layer 350 may be used as a channelregion of the semiconductor memory device as described below.

Referring to FIG. 9E, a filling layer 360 may be formed in the throughregion 330. The filling layer 360 may be formed to fill the gap region335. An insulating layer filling the gap region 335 may be formed andthen a planarization process may be performed on the insulating layer toform the filling layer 360. Alternatively, the semiconductor layer 350may be formed to fill the through region 330, so that the filling layer360 may not be formed.

Referring to FIG. 9F, the semiconductor layer 350 may be patterned toform semiconductor patterns 370 upwardly extending from thesemiconductor substrate 300 in the through regions 330. Thesemiconductor patterns 370 and the gate patterns may constitutetransistors three dimensionally arranged. Patterning the semiconductorlayer 350 may include forming separation regions 372 dividing thesemiconductor layer 350 into the semiconductor patterns 370. Each of theseparation regions 372 may be filled with a gapfill insulating layer374. The gapfill insulating layer 374 may include a silicon oxide layer.

Referring to FIG. 9G, an upper interlayer insulating layer 380 may beformed on the gapfill insulating layer 374 and the semiconductorpatterns 370. Contact plugs 385 may be formed in the upper interlayerinsulating layer 380 to be electrically connected to the semiconductorpatterns 370, respectively. Bit lines 390 may be formed to beelectrically connected to the contact plugs 385. The bit line 390 mayextend in a direction crossing a direction in which the gate patternextends.

The gate patterns may include a plurality of word lines WL0 to WLn-1, aground select line GSL under the word lines WL0 to WLn-1, a stringselect line SSL on the word lines WL0 to WLn-1, a first dummy word lineDWL1 between the ground select line GSL and the word line WL0 which is aword line nearest to the ground select line GSL among the word lines WL0to WLn-1, and a second dummy word line DWL2 between the string selectline SSL and the word line WLn-1 which is a word line nearest to thestring select line SSL among the word lines WL0 to WLn-1. Each of thefirst distance L1 between the ground select line GSL and the first dummyword line DWL1 or between the string select line SSL and the seconddummy word line DWL2 and the second distance L2 between the first dummyword line DWL1 and the word line WL0 or between the second dummy wordline DWL2 and the word line WLn-1 is greater than a third distance L3between a pair of the word lines adjacent to each other among the wordlines WL0 to WLn-1.

FIGS. 10A to 10G are perspective views illustrating a method of forminga nonvolatile memory device according to an embodiment of the inventiveconcept.

Referring to FIG. 10A, a thin layer structure 415 including, a pluralityof thin layers may be formed on a semiconductor substrate 400. Thesemiconductor substrate 400 may be formed of single-crystalline silicon.Alternatively, the semiconductor substrate 400 may be formed of asemiconductor material providing other semiconductor characteristicsthan the single-crystalline silicon.

The thin layer structure 415 may include insulating layers 410 andconductive layers 420 which are alternately and repeatedly stacked. Forexample, the thin layer structure 415 may include a plurality of theinsulating layers 410 sequentially stacked and a plurality of theconductive layers 420 interposed between the insulating layers 410. Forexample, each of the insulating layers 410 may include a silicon oxidelayer and/or a silicon nitride layer, and each of the conductive layers420 may be formed of poly-crystalline silicon doped with impuritiesand/or a metallic material. A buffer insulating layer 405 may be formedbetween the semiconductor substrate 400 and the thin layer structure415. The buffer insulating layer 405 may include a silicon oxide layer.

Referring to FIG. 10B, the thin layer structure 415 may be patterned toform a plurality of through regions 430 exposing a top surface of thesemiconductor substrate 400. Patterning the thin layer structure 415 mayinclude patterning the insulating layers 410 and the conductive layers420 to form insulating patterns 412 and gate patterns 422. In moredetail, a mask pattern (not shown) defining top viewed locations of thethrough regions 430 may be formed on the thin layer structure 415, andthen the thin layer structure 415 may be anisotropically etched usingthe mask pattern as an etch mask to form the through regions 430. Thethrough regions 430 may be formed two dimensionally and regularly.

As illustrated in FIG. 10B, each of the through regions 430 may have ahole-shape which has a circular bottom surface exposing thesemiconductor substrate 400. A lowermost gate pattern of the stackedgate patterns 422 may be used as a ground select line.

Referring to FIG. 10C, a data storage layer 440 may be formed to coverthe inner sidewalls of the through regions 430. The data storage layer440 may include a charge trapping layer 444 having charge trap sites.The data storage layer 440 may further include a blocking insulatinglayer 446 contacting the gate patterns 422 and a tunnel insulating layer442. Charges may tunnel the tunnel insulating layer 442. The chargetrapping layer 444 may include a silicon nitride layer formed, betweenthe tunnel insulating layer 442 and the blocking insulating layer 446.The tunnel insulating layer 442 may include a silicon oxide layer. Theblocking insulating layer 446 may include a high-k dielectric layer(e.g. an aluminum oxide layer or a hafnium oxide layer).

However, the data storage layer 440 is not limited to the thin layersdescribed above. According to an embodiment, the data storage layer 440may include a thin layer (e.g. a thin layer for a variable resistancememory) storing data by other operation principles. A preliminary datastorage layer may be conformally formed on the inner sidewalk of thethrough region 430 and the semiconductor substrate 400 under the throughregions 430, and then a portion of the preliminary data storage layercovering the semiconductor substrate 400 may be etched using spacers(not shown) covering the inner sidewalls of the through regions 430 asetch masks to form the data storage layer 440. The spacers may includean insulating layer. The spacers may be removed after the data storagelayer 440 is formed.

Referring to FIG. 10D, a semiconductor layer may be formed to cover thethrough regions 430. A portion of the semiconductor layer outside thethrough regions 430 may be removed to form a semiconductor pattern 450in each of the through regions 430. The semiconductor pattern 450 may beformed to define a gap region 435 in each of the through regions 430.The semiconductor pattern 450 may be used as a channel region of thesemiconductor memory device as described below.

Referring to FIG. 10E, a filling layer 460 may be formed in the throughregion 430. The filling layer 460 may be formed to fill the gap region435. An insulating layer filling the gap region 435 may be formed andthen a planarization process may be performed on the insulating layer toform the filling layer 460. According to an embodiment, before thesemiconductor patterns 450 are formed, the insulating layer filling thegap region 435 may be formed on the semiconductor layer, and then theinsulating layer and the semiconductor layer may be subsequentlyplanarized to form the filling layer 460 and the semiconductor pattern450. Alternatively, the semiconductor layer may be formed to fill thethrough region 430, so that the filling layer 460 may not be formed.

Referring to FIG. 10F, an uppermost gate pattern may be patterned toform string, select lines SSL. The string select line SSL may extend ina direction crossing the semiconductor pattern 450. After the stringselect lines SSL are formed, an insulating layer may be formed betweenthe string select lines SSL.

Referring to FIG. 10G, an upper interlayer insulating layer 480 may beformed to cover the semiconductor patterns 450. Contact plugs 485 may beformed in the upper interlayer insulating layer 480 to be electricallyconnected to the semiconductor patterns 450, respectively. Bit lines 490may be formed to be electrically connected to the contact plugs 485. Thebit lines 490 may cross the string select lines SSL.

The gate patterns may include a plurality of word lines WL0 to WLn-1, aground select line GSL under the word lines WL0 to WLn-1, a stringselect line SSL on the word lines WL0 to WLn-1, a first dummy word lineDWL1 between the ground select line GSL and the word line WL0 which is aword line nearest to the ground select line GSL among the word lines WL0to WLn-1, and a second dummy word line DWL2 between the string selectline SSL and the word line WLn-1 which is a word line nearest to thestring select line SSL among the word lines WL0 to WLn-1. Each of thefirst distance L1 between the ground select line GSL and the first dummyword line DWL1 or between the string select line SSL and the seconddummy word line DWL2 and the second distance L2 between the first dummyword line DWL1 and the word line WL0 or between the second dummy wordline DWL2 and the word line WLn-1 is greater than a third distance L3between a pair of the word lines adjacent to each other among the wordlines WL0 to WLn-1.

FIG. 11 is a schematic block diagram illustrating an example of a memorysystem including a nonvolatile memory device according to an embodimentof the inventive concept.

Referring to FIG. 11, a memory system 600 may be applied to a personaldigital assistant (PDA), a portable computer, a web tablet, a wirelessphone, a mobile phone, a digital music player, a memory card, or otherelectronic products. The other electronic products may receive ortransmit information data by wireless.

The memory system 600 may include a controller 610, an input/output(I/O) unit 620, a memory device 630, an interface unit 640, and a databus 650. The memory device 630 and the interface unit 640 maycommunicate with each other through the data bus 650.

The controller 610 may include at least one of a microprocessor, adigital signal processor, a microcontroller, or other logic devices. Theother logic devices may have a similar function to any one of themicroprocessor, the digital signal processor, and the microcontroller.The memory device 630 may store data and/or commands. The I/O unit 620may receive data or signals from the outside of the memory system 600 ortransmit data or signals to the outside. For example, the I/O unit 620may include a keypad, a keyboard, and/or a display unit.

The memory device 630 may include a nonvolatile memory device accordingto an embodiment of the inventive concept. The memory device 630 mayfurther include random access volatile memories and/or other types ofsemiconductor memory devices. The interface unit 640 may transmitelectrical data to a communication network or may receive electricaldata from a communication network.

FIG. 12 is a schematic block diagram illustrating an example of a memorycard including a nonvolatile memory device according to an embodiment ofthe inventive concept.

Referring to FIG. 12, a memory card 700 for mass data storage mayinclude a flash memory device 710 according to an embodiment of theinventive concept. The memory card 700 according to an embodiment of theinventive concept may include a memory controller 720 that controls datacommunication between a host and the memory device 710. An SRAM device721 may be used as an operation memory of a central processing unit(CPU) 722. A host interface unit 723 may be configured to include a datacommunication protocol between the memory card 700 and the host. Anerror check and correction (ECC) block 724 may detect and correct errorsof data which are read out from the multi-bit flash memory device 710. Amemory interface unit 725 may interface with the flash memory device710. The CPU 722 controls the overall operation for data exchange of thememory controller 720. Even though not shown in the drawings, the memorycard 700 may further include a read only memory (ROM) device that storescode data to interface with the host.

FIG. 13 is a schematic block diagram illustrating an example of aninformation processing system including a nonvolatile memory deviceaccording to an embodiment of the inventive concept.

Referring to FIG. 13, an information processing system, such as a mobiledevice or a task top computer, may include a flash memory system 810according to an embodiment of the inventive concept. The informationprocessing system 800 may include a modem 820 electrically connected tothe flash memory system 810 and a system bus 860, a CPU 830, a ram 840,and an user interface 850. The flash memory system 810 may include aflash memory 811 and a memory controller 812 controlling the flashmemory 811. The flash memory system 810 may include substantially thesame elements as the elements of the memory system or the flash memorysystem described above. Data processed by the CPU 830 or inputted fromthe outside may be stored in the flash memory system 810. The flashmemory system 810 may constitute a solid state drive (SSD). According toan embodiment, the information processing system 800 may stably storemass data in the flash memory system 810. As reliability increases,resources of the flash memory system 810 for error correction may bedecreased, thereby providing a faster data exchange function to theinformation processing system 800. Even though not shown in thedrawings, the information processing system 800 may further include anapplication chipset, a camera image processor (CIS), and/or an input/outunit.

The nonvolatile memory devices or the memory system according to theembodiments of the inventive concept may be encapsulated using variouspackaging techniques. For example, the nonvolatile memory devices or thememory system according to the aforementioned embodiments may beencapsulated using arty one of at package on package (POP) technique, aball grid arrays (BGAs) technique, a chip scale packages (CSPs)technique, a plastic leaded chip carrier (PLCC) technique, a plasticdual in-line package (PDIP) technique, a die in waffle pack technique, adie in wafer form technique, a chip on board (COB) technique, a ceramicdual in-line package (CERDIP) technique, a plastic metric quad flatpackage (PMQFP) technique, a plastic quad flat package (PQFP) technique,a small outline package (SOIC) technique, a shrink small outline package(SSOP) technique, a thin small outline package (TSOP) technique, a thinquad flat package (TQFP) technique, a system in package (SIP) technique,a multi chip package (MCP) technique, a water-level fabricated package(WFP) technique and a wafer-level processed stack package (WSP)technique.

According to the embodiments of the inventive concept, distances betweenthe dummy word line, the word lines, the ground select line, and thestring select line can be controlled. Thus, a program disturbancephenomenon may be minimized and a cell current may be secured.

While the inventive concept has been described with reference to exampleembodiments, it will be apparent to those skilled in the art thatvarious changes and modifications may be made without departing from thespirit and scope of the inventive concept. Therefore, it should beunderstood that the above embodiments are not limiting, butillustrative. Thus, the scope of the inventive concept is to bedetermined by the broadest permissible interpretation of the followingclaims and their equivalents, and shall not be restricted or limited bythe foregoing description.

What is claimed is:
 1. A method of forming a nonvolatile memory device, comprising: forming an alternating and repeated sequence of gate patterns and insulating patterns on a semiconductor substrate; forming a semiconductor pattern that penetrates the gate patterns and the insulating patterns and upwardly extends from the semiconductor substrate; and forming a data storage layer between the semiconductor pattern and the gate patterns, wherein the gate patterns include: cell string word lines including a first word line, a second word line and a pair of third word lines immediately adjacent to each other, wherein the cell string word lines, the data storage layer and the semiconductor pattern form a cell string comprising a plurality of memory cell transistors, each of the plurality of memory cell transistors having a gate formed by a corresponding one of the cell string word lines, a ground select line under the cell string word lines, a string select line on the cell string word lines, a first dummy word line between the ground select line and the first word line, wherein the first word line is nearer to the ground select line than any of the cell string word lines of the cell string, and a second dummy word line between the string select line and the second word line, wherein the second word line is nearer to the string select line than any of the cell string word lines of the cell string, wherein a first distance between the ground select line and the first dummy word line is greater than a second distance between the first dummy word line and the first word line, wherein the first distance is greater than a third distance between the pair of third word lines immediately adjacent to each other, and wherein the second distance is greater than the third distance.
 2. The method of claim 1, wherein each of a distance between the string select line and the second dummy word line and a distance between the second dummy word line and the second word line is greater than the third distance.
 3. The method of claim 1, wherein the insulating layers comprise a first insulating layer between the ground select line and the first dummy line having a first thickness, a second insulating layer between the first dummy word line and the first word line having a second thickness, and a third insulating layer between the pair of third word lines having a third thickness, wherein the first thickness, the second thickness and the third thickness are different from each other, and wherein the first distance, the second distance, and the third distance are respectively greater than the first thickness, the second thickness and the third thickness.
 4. The method of claim 1, wherein the insulating layers comprise a first insulating layer between the ground select line and the first dummy line having a first thickness, a second insulating layer between the first dummy word line and the first word line having a second thickness, and a third insulating layer between the pair of third word lines having a third thickness, wherein the first thickness, the second thickness and the third thickness are different from each other, and wherein the first distance, the second distance, and the third distance are respectively greater than the first thickness, the second thickness and the third thickness. 